Semiconductor Bonding Market size is projected to
reach 1064.38 million USD by 2027 from an estimated 875.98 million USD in 2021,
growing at a CAGR of 3.3% globally.
Semiconductors are made up of atoms bonded together to form a uniform structure. Each silicon atom has four valence electrons which are shared, forming covalent bonds with the four surrounding Si atoms. Direct bonding, or fusion bonding, describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. These requirements are specified for the wafer surface as sufficiently clean, flat and smooth. Otherwise unbounded areas so called voids, i.e. interface bubbles, can occur. Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another.
IMR offers a comprehensive overview of the market through the analysis of key parameters such as revenue, price, competition, and promotions, as well as the study, synthesis, and summarization of data from different sources. It analyzes the leading industry drivers and shows numerous market components. The information offered is thorough, dependable, and the result of a comprehensive primary and secondary study. IMR market research reports offer a comprehensive global market as well as an in-depth strategic sourcing methodology and analysis based on qualitative and quantitative research to anticipate market growth.
Key Players Covered In Semiconductor Bonding Market Are:
· BE Semiconductor Industries N.V.(Netherland)
· ASM Pacific Technology Ltd.(Singapore)
· Kulicke & Soffa(Singapore)
· Fuji Corporation(Japan)
· Yamaha Motor Robotics Corporation Co.(Japan)
· SUSS MicroTech SE(Germany)
· Shiaura Mechatronics(Japan)
Market has segmented the global Semiconductor Bonding market on the basis of type, application, and region:
· Die Bonder
· Wafer Bonder
· and Flip Chip Bonder
· RF Devices
· MEMS and Sensors
· 3D NAND and CMOS Image Sensors
By Regional Outlook (Revenue, USD Billion, 2017 – 2028)
· North America (U.S., Canada, Mexico)
· Europe (Germany, U.K., France, Italy, Russia, Spain, Rest of Europe)
· Asia-Pacific (China, India, Japan, Southeast Asia, Rest of APAC)
· Middle East & Africa (GCC Countries, South Africa, Rest of MEA)
· South America (Brazil, Argentina, Rest of South America)
Impact and Recovery Analysis on Industry:
The COVID-19 pandemic has had devastating effects on several industry verticals globally. To constrain the number of cases and slow the coronavirus spread, various public health guidelines were implemented in different countries across the globe. COVID-19 protocols ranging from declaring national emergency states, enforcing stay-at-home orders, closing nonessential business operations and schools, banning public gatherings, imposing curfews, distributing digital passes, and allowing police to restrict citizen movements within a country, as well as closing international borders. With the growing vaccination rate, governments are uplifting the protocols to give a boost to the stagnant economy. Like other industries, Cloud Service Mesh Market have experienced slowdown the growth, however market is expected bounce back as restrictions are being lifted up by governments across the globe.
Semiconductor Bonding Market report covers the
detailed analysis on current and upcoming market trends, company market shares,
market projections, competitive benchmarking, competition mapping, and in-depth
research of the most significant sustainability strategies and their impact on
industry growth and competition. The research was conducted using a combination
of primary and secondary data, as well as input from leading industry players.
· In October 2020, BE Semiconductor Industries N.V. (Besi) collaborated with Applied Materials, Inc. to develop the industry's first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI, and 5G.
· In January 2021, ASM PACIFIC TECHNOLOGY (ASMPT) and EV GROUP (EVG) collaborated to create die-to-wafer hybrid bonding solutions for 3D-IC and heterogeneous integration applications. Chiplet technology combines chips with different process nodes into advanced packaging systems that can power new applications such as 5G, high-performance computing (HPC), and artificial intelligence.
· Die-to-wafer hybrid bonding is a key process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology—combining chips with different process nodes into advanced packaging systems that can power new applications such as 5G, HPC, and artificial intelligence (AI).